Home / Products / Resistors / Through Hole Resistors / H8309KBDA
Manufacturer Part Number | H8309KBDA |
---|---|
Future Part Number | FT-H8309KBDA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H8309KBDA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 309 kOhms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±25ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H8309KBDA Weight | Contact Us |
Replacement Part Number | H8309KBDA-FT |
H8243RBZA
TE Connectivity Passive Product
H8249RBCA
TE Connectivity Passive Product
H8249RBDA
TE Connectivity Passive Product
H8249RBZA
TE Connectivity Passive Product
H824K9BCA
TE Connectivity Passive Product
H824K9BDA
TE Connectivity Passive Product
H824K9BZA
TE Connectivity Passive Product
H824R3BCA
TE Connectivity Passive Product
H824R3BDA
TE Connectivity Passive Product
H824R3BYA
TE Connectivity Passive Product
LFXP6E-4T144C
Lattice Semiconductor Corporation
LCMXO2-1200ZE-1TG100I
Lattice Semiconductor Corporation
EX256-TQG100A
Microsemi Corporation
XCKU035-3FBVA676E
Xilinx Inc.
XC6SLX75-N3FG676C
Xilinx Inc.
AGL030V5-UCG81
Microsemi Corporation
M1A3P250-2PQ208
Microsemi Corporation
M2GL010-1VFG400I
Microsemi Corporation
5SGXMA9K3H40C2N
Intel
A42MX16-1PQ160M
Microsemi Corporation