Home / Products / Resistors / Through Hole Resistors / H824R3BCA
Manufacturer Part Number | H824R3BCA |
---|---|
Future Part Number | FT-H824R3BCA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H824R3BCA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 24.3 Ohms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±50ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H824R3BCA Weight | Contact Us |
Replacement Part Number | H824R3BCA-FT |
H8105KBZA
TE Connectivity Passive Product
H8105KDCA
TE Connectivity Passive Product
H8105KDYA
TE Connectivity Passive Product
H8105KDZA
TE Connectivity Passive Product
H810K5BZA
TE Connectivity Passive Product
H8110KBZA
TE Connectivity Passive Product
H8110KDYA
TE Connectivity Passive Product
H8110KDZA
TE Connectivity Passive Product
H8110KFCA
TE Connectivity Passive Product
H8110KFDA
TE Connectivity Passive Product
XCV50-6TQ144C
Xilinx Inc.
XCV100E-7FG256C
Xilinx Inc.
XC7A75T-L2FGG676E
Xilinx Inc.
M2GL005-1FG484
Microsemi Corporation
LFE5UM-45F-6BG554C
Lattice Semiconductor Corporation
A3PN060-Z2VQ100
Microsemi Corporation
5SGXEA9N1F45I2N
Intel
XC5VLX330T-2FFG1738C
Xilinx Inc.
XC6SLX9-2CPG196C
Xilinx Inc.
5SGXMA3H3F35C4N
Intel