Home / Products / Capacitors / Ceramic Capacitors / FK26X7R2E473KN006
Manufacturer Part Number | FK26X7R2E473KN006 |
---|---|
Future Part Number | FT-FK26X7R2E473KN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK26X7R2E473KN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.047µF |
Tolerance | ±10% |
Voltage - Rated | 250V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK26X7R2E473KN006 Weight | Contact Us |
Replacement Part Number | FK26X7R2E473KN006-FT |
FK18X7S2A473KR006
TDK Corporation
FK18X7S2A683KR006
TDK Corporation
FK26C0G1H103JN006
TDK Corporation
FK26C0G1H104JN006
TDK Corporation
FK26C0G1H153JN006
TDK Corporation
FK26C0G1H223JN006
TDK Corporation
FK26C0G1H333JN006
TDK Corporation
FK26C0G1H472JN006
TDK Corporation
FK26C0G1H473JN006
TDK Corporation
FK26C0G1H562JN006
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel