Home / Products / Capacitors / Ceramic Capacitors / FK26C0G1H153JN006
Manufacturer Part Number | FK26C0G1H153JN006 |
---|---|
Future Part Number | FT-FK26C0G1H153JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK26C0G1H153JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.015µF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK26C0G1H153JN006 Weight | Contact Us |
Replacement Part Number | FK26C0G1H153JN006-FT |
FK18C0G1H681JN006
TDK Corporation
FK18C0G1H682JN006
TDK Corporation
FK18C0G1H6R8DN006
TDK Corporation
FK18C0G1H820JN006
TDK Corporation
FK18C0G1H821JN006
TDK Corporation
FK18C0G1H822JN006
TDK Corporation
FK18C0G2A101JN006
TDK Corporation
FK18C0G2A102JN006
TDK Corporation
FK18C0G2A121JN006
TDK Corporation
FK18C0G2A122JN006
TDK Corporation
AT6010A-2AU
Microchip Technology
XC2VP50-5FF1517C
Xilinx Inc.
XA3S250E-4VQG100Q
Xilinx Inc.
XC7A50T-L1FGG484I
Xilinx Inc.
APA600-FGG256A
Microsemi Corporation
EP4CE30F23C8N
Intel
XC7K355T-2FFG901C
Xilinx Inc.
LFE2M20E-6FN256I
Lattice Semiconductor Corporation
5CGXFC7D6F31C7N
Intel
10AX066K3F40I2LG
Intel