Home / Products / Capacitors / Ceramic Capacitors / FK26X7R2E223KN006
Manufacturer Part Number | FK26X7R2E223KN006 |
---|---|
Future Part Number | FT-FK26X7R2E223KN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK26X7R2E223KN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.022µF |
Tolerance | ±10% |
Voltage - Rated | 250V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK26X7R2E223KN006 Weight | Contact Us |
Replacement Part Number | FK26X7R2E223KN006-FT |
FK18X7S2A104KR006
TDK Corporation
FK18X7S2A333KR006
TDK Corporation
FK18X7S2A473KR006
TDK Corporation
FK18X7S2A683KR006
TDK Corporation
FK26C0G1H103JN006
TDK Corporation
FK26C0G1H104JN006
TDK Corporation
FK26C0G1H153JN006
TDK Corporation
FK26C0G1H223JN006
TDK Corporation
FK26C0G1H333JN006
TDK Corporation
FK26C0G1H472JN006
TDK Corporation
M1A3PE3000L-FG484I
Microsemi Corporation
A3PN010-QNG48
Microsemi Corporation
A3P400-2FGG256
Microsemi Corporation
XC4020XL-3HT176I
Xilinx Inc.
EP4CE10F17C6
Intel
5SGXMB6R2F40C3N
Intel
10AX027H4F35I3LG
Intel
XC7A35T-1CSG324C
Xilinx Inc.
LCMXO256E-5M100C
Lattice Semiconductor Corporation
EP1S40F780C8
Intel