Home / Products / Capacitors / Ceramic Capacitors / FK18C0G1H821JN006
Manufacturer Part Number | FK18C0G1H821JN006 |
---|---|
Future Part Number | FT-FK18C0G1H821JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18C0G1H821JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 820pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18C0G1H821JN006 Weight | Contact Us |
Replacement Part Number | FK18C0G1H821JN006-FT |
FK16X5R0J156MN006
TDK Corporation
FK16X5R0J156MN020
TDK Corporation
FK16X5R0J226MN006
TDK Corporation
FK16X5R0J226MN020
TDK Corporation
FK16X5R0J336MR006
TDK Corporation
FK16X5R0J476MR006
TDK Corporation
FK16X5R0J685KN006
TDK Corporation
FK16X5R1A106KN006
TDK Corporation
FK16X5R1A106KN020
TDK Corporation
FK16X5R1A685KN006
TDK Corporation
XC6SLX100T-2FGG676C
Xilinx Inc.
XC2V1000-4FG456I
Xilinx Inc.
A3PE1500-FGG484I
Microsemi Corporation
APA300-PQG208
Microsemi Corporation
EP2C50U484I8
Intel
5SGXEA4K2F40C1N
Intel
EP2AGX95DF25C5
Intel
10AX032E2F27I2SG
Intel
5SGXEA9N2F45I2L
Intel
ICE40LP384-CM49TR
Lattice Semiconductor Corporation