Home / Products / Capacitors / Ceramic Capacitors / FK24C0G1H392JN006
Manufacturer Part Number | FK24C0G1H392JN006 |
---|---|
Future Part Number | FT-FK24C0G1H392JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK24C0G1H392JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 3900pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.177" L x 0.098" W (4.50mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK24C0G1H392JN006 Weight | Contact Us |
Replacement Part Number | FK24C0G1H392JN006-FT |
FK22X7R1H475KR006
TDK Corporation
FK22X7R1H685KR006
TDK Corporation
FK22X7R2A105KN006
TDK Corporation
FK22X7R2A155KN006
TDK Corporation
FK22X7R2A225KN006
TDK Corporation
FK22X7R2A684KN006
TDK Corporation
FK22X7R2E154KN006
TDK Corporation
FK22X7R2E224KN006
TDK Corporation
FK22X7R2E334KN006
TDK Corporation
FK22X7R2E474KN006
TDK Corporation
XC4005E-3TQ144C
Xilinx Inc.
XC4013XL-3PQ208C
Xilinx Inc.
A3P250-2VQG100
Microsemi Corporation
EP2S30F484C3
Intel
EP3SE50F484C2
Intel
EP3C25F256C6N
Intel
5SGXMA7N1F45I2N
Intel
A3P250L-FGG144
Microsemi Corporation
LCMXO640C-3M132C
Lattice Semiconductor Corporation
EP4SGX180FF35I4N
Intel