Home / Products / Capacitors / Ceramic Capacitors / FK22X7R2A684KN006
Manufacturer Part Number | FK22X7R2A684KN006 |
---|---|
Future Part Number | FT-FK22X7R2A684KN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK22X7R2A684KN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.68µF |
Tolerance | ±10% |
Voltage - Rated | 100V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.295" L x 0.157" W (7.50mm x 4.00mm) |
Height - Seated (Max) | 0.315" (8.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK22X7R2A684KN006 Weight | Contact Us |
Replacement Part Number | FK22X7R2A684KN006-FT |
C2012C0G2A153J085AE
TDK Corporation
C2012C0G2A223J125AE
TDK Corporation
C2012C0G2E682J125AE
TDK Corporation
C2012C0G2W101J060AE
TDK Corporation
C2012C0G2W102J060AE
TDK Corporation
C2012C0G2W331J060AE
TDK Corporation
C2012C0G2W471J060AE
TDK Corporation
C1608C0G2A102J080AE
TDK Corporation
C1608C0G2A122J080AE
TDK Corporation
C1608C0G2A103J080AE
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel