Home / Products / Capacitors / Ceramic Capacitors / FK18X5R0J225KR006
Manufacturer Part Number | FK18X5R0J225KR006 |
---|---|
Future Part Number | FT-FK18X5R0J225KR006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK18X5R0J225KR006 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 2.2µF |
Tolerance | ±10% |
Voltage - Rated | 6.3V |
Temperature Coefficient | X5R |
Operating Temperature | -55°C ~ 85°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.098" (2.50mm) |
Lead Style | Formed Leads |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK18X5R0J225KR006 Weight | Contact Us |
Replacement Part Number | FK18X5R0J225KR006-FT |
FK26X7R2E473KN006
TDK Corporation
FK26X7R2E683KN006
TDK Corporation
FK26X7R2J102KN006
TDK Corporation
FK26X7R2J103KN006
TDK Corporation
FK26X7R2J152KN006
TDK Corporation
FK26X7R2J153KN006
TDK Corporation
FK26X7R2J222KN006
TDK Corporation
FK26X7R2J223KN006
TDK Corporation
FK26X7R2J332KN006
TDK Corporation
FK26X7R2J333KN006
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel