Home / Products / Capacitors / Ceramic Capacitors / C3225X7R1H155K200AA
Manufacturer Part Number | C3225X7R1H155K200AA |
---|---|
Future Part Number | FT-C3225X7R1H155K200AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3225X7R1H155K200AA Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1.5µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | Low ESL |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.087" (2.20mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3225X7R1H155K200AA Weight | Contact Us |
Replacement Part Number | C3225X7R1H155K200AA-FT |
C3225NP01H683J200AA
TDK Corporation
C3225NP02A153J125AA
TDK Corporation
C3225NP02A223J160AA
TDK Corporation
C3225NP02A333J200AA
TDK Corporation
C3225NP02A473J230AA
TDK Corporation
C3225NP02E473J250AA
TDK Corporation
C3225NP02J103J125AA
TDK Corporation
C3225NP02J153J160AA
TDK Corporation
C3225NP02J223J230AA
TDK Corporation
C3225NP02J333J250AA
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel