Home / Products / Capacitors / Ceramic Capacitors / C3225NP02A333J200AA
Manufacturer Part Number | C3225NP02A333J200AA |
---|---|
Future Part Number | FT-C3225NP02A333J200AA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | C |
C3225NP02A333J200AA Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Capacitance | 0.033µF |
Tolerance | ±5% |
Voltage - Rated | 100V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 150°C |
Features | High Temperature |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 1210 (3225 Metric) |
Size / Dimension | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.087" (2.20mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
C3225NP02A333J200AA Weight | Contact Us |
Replacement Part Number | C3225NP02A333J200AA-FT |
C3225X7R2E154M200AA
TDK Corporation
C3225X7R2J473K200AE
TDK Corporation
C3225X7R2J473M200AE
TDK Corporation
C3225X7R2J683M200AA
TDK Corporation
C3225X7S3D222K250AA
TDK Corporation
C3225X7T2J154M200AC
TDK Corporation
C3225X8L1C156M200AC
TDK Corporation
C3225X8L1H335K200AC
TDK Corporation
C3225X8R1C685K200AB
TDK Corporation
C3225X8R1C685M200AB
TDK Corporation
AT6010A-2AU
Microchip Technology
XC2VP50-5FF1517C
Xilinx Inc.
XA3S250E-4VQG100Q
Xilinx Inc.
XC7A50T-L1FGG484I
Xilinx Inc.
APA600-FGG256A
Microsemi Corporation
EP4CE30F23C8N
Intel
XC7K355T-2FFG901C
Xilinx Inc.
LFE2M20E-6FN256I
Lattice Semiconductor Corporation
5CGXFC7D6F31C7N
Intel
10AX066K3F40I2LG
Intel