Home / Products / Integrated Circuits (ICs) / Interface - Telecom / ZL88701LDG1
Manufacturer Part Number | ZL88701LDG1 |
---|---|
Future Part Number | FT-ZL88701LDG1 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
ZL88701LDG1 Status (Lifecycle) | In Stock |
Part Status | Active |
Function | Telecom Circuit |
Interface | PCM |
Number of Circuits | 1 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | - |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 64-VFQFN Exposed Pad |
Supplier Device Package | 64-QFN (9x9) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
ZL88701LDG1 Weight | Contact Us |
Replacement Part Number | ZL88701LDG1-FT |
VSC7449YIH-01
Microchip Technology
BCM84754A1KFSBG
Broadcom Limited
PM8310A-FEI
Microchip Technology
ZL50016QCG1
Microsemi Corporation
PM5326-FEI
Microchip Technology
LE88010BQC
Microsemi Corporation
LE88010BQCT
Microsemi Corporation
LE88131BLC
Microsemi Corporation
LE88131BLCT
Microsemi Corporation
LE9641PQC
Microsemi Corporation
XCV600E-6FG676I
Xilinx Inc.
APA1000-PQ208M
Microsemi Corporation
LFE5UM-85F-7BG756I
Lattice Semiconductor Corporation
EPF10K10ATC100-3N
Intel
EP3SL200H780C4N
Intel
10CL025YE144I7G
Intel
XC5VLX85-1FF676C
Xilinx Inc.
LFE2-12SE-5F484C
Lattice Semiconductor Corporation
LCMXO2280C-4FT324C
Lattice Semiconductor Corporation
5CEBA4F23C7N
Intel