Home / Products / Integrated Circuits (ICs) / Interface - Telecom / ZL88701LDF1
Manufacturer Part Number | ZL88701LDF1 |
---|---|
Future Part Number | FT-ZL88701LDF1 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
ZL88701LDF1 Status (Lifecycle) | In Stock |
Part Status | Active |
Function | Telecom Circuit |
Interface | PCM |
Number of Circuits | 1 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | - |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 64-VFQFN Exposed Pad |
Supplier Device Package | 64-QFN (9x9) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
ZL88701LDF1 Weight | Contact Us |
Replacement Part Number | ZL88701LDF1-FT |
PM5370-FEI
Microchip Technology
VSC7449YIH-01
Microchip Technology
BCM84754A1KFSBG
Broadcom Limited
PM8310A-FEI
Microchip Technology
ZL50016QCG1
Microsemi Corporation
PM5326-FEI
Microchip Technology
LE88010BQC
Microsemi Corporation
LE88010BQCT
Microsemi Corporation
LE88131BLC
Microsemi Corporation
LE88131BLCT
Microsemi Corporation
LCMXO2-1200ZE-2TG144IR1
Lattice Semiconductor Corporation
XC6SLX150-3FGG900C
Xilinx Inc.
XC3S400-4FGG456C
Xilinx Inc.
EP3C80F484C6
Intel
EP4SGX290KF40C2N
Intel
10AX027E3F29E2LG
Intel
XC7VX1140T-2FLG1930C
Xilinx Inc.
EP4CGX30CF19C8
Intel
EPF10K50VRC240-3N
Intel
5SGSMD3H3F35C2L
Intel