Home / Products / Integrated Circuits (ICs) / Interface - Telecom / ZL88602LDF1
Manufacturer Part Number | ZL88602LDF1 |
---|---|
Future Part Number | FT-ZL88602LDF1 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
ZL88602LDF1 Status (Lifecycle) | In Stock |
Part Status | Active |
Function | Telecom Circuit |
Interface | PCM |
Number of Circuits | 1 |
Voltage - Supply | 3.135V ~ 3.465V |
Current - Supply | - |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 64-VFQFN Exposed Pad |
Supplier Device Package | 64-QFN (9x9) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
ZL88602LDF1 Weight | Contact Us |
Replacement Part Number | ZL88602LDF1-FT |
MT9126AE1
Microsemi Corporation
ZL50017QCG1
Microsemi Corporation
PM5370-FEI
Microchip Technology
VSC7449YIH-01
Microchip Technology
BCM84754A1KFSBG
Broadcom Limited
PM8310A-FEI
Microchip Technology
ZL50016QCG1
Microsemi Corporation
PM5326-FEI
Microchip Technology
LE88010BQC
Microsemi Corporation
LE88010BQCT
Microsemi Corporation
LCMXO2-7000ZE-1TG144C
Lattice Semiconductor Corporation
XC7A35T-L1CSG325I
Xilinx Inc.
A42MX24-PQG208A
Microsemi Corporation
A42MX09-FVQG100
Microsemi Corporation
EP3C55F484C6
Intel
5SGXEB9R2H43I2N
Intel
XC7VX1140T-1FL1928C
Xilinx Inc.
A42MX09-1PLG84I
Microsemi Corporation
LFE5U-25F-7BG256I
Lattice Semiconductor Corporation
EP2SGX60CF780C4
Intel