Home / Products / Integrated Circuits (ICs) / Interface - Telecom / ZL50112GAG2
Manufacturer Part Number | ZL50112GAG2 |
---|---|
Future Part Number | FT-ZL50112GAG2 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
ZL50112GAG2 Status (Lifecycle) | In Stock |
Part Status | Active |
Function | Telecom Circuit |
Interface | TDM |
Number of Circuits | 1 |
Voltage - Supply | 1.65V ~ 1.95V |
Current - Supply | 950mA |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 552-BGA |
Supplier Device Package | 552-PBGA (35x35) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
ZL50112GAG2 Weight | Contact Us |
Replacement Part Number | ZL50112GAG2-FT |
LE88506DVCT
Microsemi Corporation
LE88830KQC
Microsemi Corporation
LE88830KQCT
Microsemi Corporation
LE89116QVC
Microsemi Corporation
LE89116QVCT
Microsemi Corporation
LE89156PQC
Microsemi Corporation
LE89156PQCT
Microsemi Corporation
LE89810BSC
Microsemi Corporation
LE89810BSCT
Microsemi Corporation
LE9530CETC
Microsemi Corporation
EX256-TQ100
Microsemi Corporation
XC4005E-4PQ208I
Xilinx Inc.
LFE3-17EA-8LFTN256I
Lattice Semiconductor Corporation
5SGXEA7N2F40I3
Intel
XC4VLX160-10FFG1148C
Xilinx Inc.
XC2VP30-7FFG896C
Xilinx Inc.
M1AGL1000V2-CSG281I
Microsemi Corporation
LFXP2-30E-5FT256I
Lattice Semiconductor Corporation
LCMXO640C-4B256C
Lattice Semiconductor Corporation
EP4CGX150DF31I7N
Intel