Home / Products / Integrated Circuits (ICs) / Embedded - System On Chip (SoC) / XCZU7CG-1FBVB900I
Xilinx Inc. XCZU7CG-1FBVB900I
- MFG Part Number
- XCZU7CG-1FBVB900I
- Available Quantity
- 30860 Pieces
- Reference Price
- USD 1968
- Our Price
- We have a big discount, please contact us
- Shipping Date
- We can ship out today
- Manufacturer
- Xilinx Inc.
- Brief Description
- Zynq® UltraScale+™ MPSoC CG IC FPGA 204 I/O 900FCBGA
- Lead Free Status / RoHS Status
- RoHS Compliant (Lead Free)
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Date Code (D/C)
- New
- Product Category
- Embedded - System On Chip (SoC)
- Stock Resource
- Franchised Distributor
- Warranty
- 360 days quality guarantee
- Datasheet
- XCZU7CG-1FBVB900I.pdf
XCZU7CG-1FBVB900I Specifications
| Manufacturer Part Number | XCZU7CG-1FBVB900I |
|---|---|
| Future Part Number | FT-XCZU7CG-1FBVB900I |
| SPQ / MOQ | Contact Us |
| Packing Material | Reel/Tray/Tube/Others |
| Series | Zynq® UltraScale+™ MPSoC CG |
| XCZU7CG-1FBVB900I Status (Lifecycle) | In Stock |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
| XCZU7CG-1FBVB900I Weight | Contact Us |
| Replacement Part Number | XCZU7CG-1FBVB900I-FT |
How To Order?
Request for Quotation - Confirm Price - Order - Payment - Shipment - DoneShipping Methods
1) DHL (1-3 days)2) FEDEX (1-3 days)
3) UPS (1-3 days)
4) TNT (2-5 days)
5) EMS (7-10 days)
6) Normal Post (10-20 days)
7) Others
Freight Calculation: Please contact us
How to Contact?
Our Email: [email protected]Payment Methods
1) Bank Transfer (Wire Transfer)2) Paypal (Credit Card)
3) Western Union
4) MoneyGram
5) Others
Related Components in Category Embedded - System On Chip (SoC)
10AS016C4U19I3SG
Intel
10AS016E3F27I1HG
Intel
10AS016E3F27I2SG
Intel
10AS016E3F29E2LG
Intel
10AS016E3F29I2LG
Intel
10AS016E3F29I2SG
Intel
10AS016E4F27E3LG
Intel
10AS016E4F27E3SG
Intel
10AS016E4F27I3LG
Intel
10AS016E4F27I3SG
Intel
Hot Selling Components
EPF6024ATI144-3
Intel
XC3SD1800A-4CS484C
Xilinx Inc.
A3PN010-2QNG48
Microsemi Corporation
LCMXO640E-5FTN256C
Lattice Semiconductor Corporation
EP3CLS70U484C8
Intel
5SGXEA7K3F40C2N
Intel
5SGSMD3E2H29I2L
Intel
5SEEBF45I2L
Intel
AGL125V2-CS196
Microsemi Corporation
EPF10K200SRC240-2X
Intel