Home / Products / Integrated Circuits (ICs) / Embedded - System On Chip (SoC) / XCZU6EG-3FFVC900E
Xilinx Inc. XCZU6EG-3FFVC900E
- MFG Part Number
- XCZU6EG-3FFVC900E
- Available Quantity
- 33330 Pieces
- Reference Price
- USD 3040.56
- Our Price
- We have a big discount, please contact us
- Shipping Date
- We can ship out today
- Manufacturer
- Xilinx Inc.
- Brief Description
- Zynq® UltraScale+™ MPSoC EG IC FPGA 204 I/O 900FCBGA
- Lead Free Status / RoHS Status
- RoHS Compliant (Lead Free)
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Date Code (D/C)
- New
- Product Category
- Embedded - System On Chip (SoC)
- Stock Resource
- Franchised Distributor
- Warranty
- 360 days quality guarantee
- Datasheet
- XCZU6EG-3FFVC900E.pdf
XCZU6EG-3FFVC900E Specifications
| Manufacturer Part Number | XCZU6EG-3FFVC900E |
|---|---|
| Future Part Number | FT-XCZU6EG-3FFVC900E |
| SPQ / MOQ | Contact Us |
| Packing Material | Reel/Tray/Tube/Others |
| Series | Zynq® UltraScale+™ MPSoC EG |
| XCZU6EG-3FFVC900E Status (Lifecycle) | In Stock |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
| XCZU6EG-3FFVC900E Weight | Contact Us |
| Replacement Part Number | XCZU6EG-3FFVC900E-FT |
How To Order?
Request for Quotation - Confirm Price - Order - Payment - Shipment - DoneShipping Methods
1) DHL (1-3 days)2) FEDEX (1-3 days)
3) UPS (1-3 days)
4) TNT (2-5 days)
5) EMS (7-10 days)
6) Normal Post (10-20 days)
7) Others
Freight Calculation: Please contact us
How to Contact?
Our Email: [email protected]Payment Methods
1) Bank Transfer (Wire Transfer)2) Paypal (Credit Card)
3) Western Union
4) MoneyGram
5) Others
Related Components in Category Embedded - System On Chip (SoC)
A2F060M3E-1TQ144
Microsemi Corporation
A2F060M3E-1TQ144I
Microsemi Corporation
A2F060M3E-1TQG144
Microsemi Corporation
A2F060M3E-1TQG144I
Microsemi Corporation
A2F060M3E-TQ144
Microsemi Corporation
A2F060M3E-TQ144I
Microsemi Corporation
A2F060M3E-TQG144
Microsemi Corporation
A2F060M3E-TQG144I
Microsemi Corporation
XC7Z030-1FBG676C
Xilinx Inc.
XC7Z030-2FFG676I
Xilinx Inc.
Hot Selling Components
XC4003E-2VQ100I
Xilinx Inc.
XC4005XL-1PQ208C
Xilinx Inc.
EP3C40U484C6
Intel
EP4CE6F17I7N
Intel
5SGXMA4K3F40I3LN
Intel
EP2AGX95DF25C6
Intel
5SEEBF45C2L
Intel
LFXP2-40E-7FN484C
Lattice Semiconductor Corporation
LCMXO2-1200ZE-2MG132IR1
Lattice Semiconductor Corporation
10AX057K2F40I1SG
Intel