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Manufacturer Part Number | XC7Z035-2FFG676I |
---|---|
Future Part Number | FT-XC7Z035-2FFG676I |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Zynq®-7000 |
XC7Z035-2FFG676I Status (Lifecycle) | In Stock |
Part Status | Active |
Architecture | MCU, FPGA |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
RAM Size | 256KB |
Peripherals | DMA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
XC7Z035-2FFG676I Weight | Contact Us |
Replacement Part Number | XC7Z035-2FFG676I-FT |
A2F060M3E-1TQ144
Microsemi Corporation
A2F060M3E-1TQ144I
Microsemi Corporation
A2F060M3E-1TQG144
Microsemi Corporation
A2F060M3E-1TQG144I
Microsemi Corporation
A2F060M3E-TQ144
Microsemi Corporation
A2F060M3E-TQ144I
Microsemi Corporation
A2F060M3E-TQG144
Microsemi Corporation
A2F060M3E-TQG144I
Microsemi Corporation
XC7Z030-1FBG676C
Xilinx Inc.
XC7Z030-2FFG676I
Xilinx Inc.