Home / Products / Capacitors / Ceramic Capacitors / UVK105CH2R2JW-F
Manufacturer Part Number | UVK105CH2R2JW-F |
---|---|
Future Part Number | FT-UVK105CH2R2JW-F |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | UVK |
UVK105CH2R2JW-F Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 2.2pF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0H |
Operating Temperature | -55°C ~ 125°C |
Features | High Q, Low Loss |
Ratings | - |
Applications | RF, Microwave, High Frequency |
Failure Rate | - |
Mounting Type | Surface Mount, MLCC |
Package / Case | 0402 (1005 Metric) |
Size / Dimension | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
Height - Seated (Max) | - |
Thickness (Max) | 0.022" (0.55mm) |
Lead Spacing | - |
Lead Style | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
UVK105CH2R2JW-F Weight | Contact Us |
Replacement Part Number | UVK105CH2R2JW-F-FT |
CK45-R3FD222K-NR
TDK Corporation
CK45-R3FD272K-NR
TDK Corporation
CK45-R3FD152K-NR
TDK Corporation
CC45SL3DD561JYNN
TDK Corporation
CK45-R3AD392K-NR
TDK Corporation
CK45-R3DD222K-NR
TDK Corporation
CC45SL3FD181JYNN
TDK Corporation
CK45-R3DD102K-NR
TDK Corporation
CC45SL3FD221JYNN
TDK Corporation
CK45-R3AD222K-NRA
TDK Corporation
A3P015-QNG68
Microsemi Corporation
M1AGL600V2-FG256
Microsemi Corporation
EP3C120F484C7N
Intel
EP2AGX65DF25I5N
Intel
EP4S100G4F45I1
Intel
5SGXEB6R2F43C3
Intel
XC6SLX16-2CPG196C
Xilinx Inc.
AGLP030V2-CS289I
Microsemi Corporation
LCMXO2-4000ZE-1MG132C
Lattice Semiconductor Corporation
EPF10K10LC84-3
Intel