Home / Products / Integrated Circuits (ICs) / Memory / THGBMHG9C4LBAIR
Manufacturer Part Number | THGBMHG9C4LBAIR |
---|---|
Future Part Number | FT-THGBMHG9C4LBAIR |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | e•MMC™ |
THGBMHG9C4LBAIR Status (Lifecycle) | In Stock |
Part Status | Last Time Buy |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND |
Memory Size | 512Gb (64G x 8) |
Clock Frequency | 52MHz |
Write Cycle Time - Word, Page | - |
Access Time | - |
Memory Interface | eMMC |
Voltage - Supply | 2.7V ~ 3.6V |
Operating Temperature | -25°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 153-WFBGA |
Supplier Device Package | 153-WFBGA (11.5x13) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
THGBMHG9C4LBAIR Weight | Contact Us |
Replacement Part Number | THGBMHG9C4LBAIR-FT |
W25Q256JVCIQ TR
Winbond Electronics
W25Q32JVTCIQ
Winbond Electronics
W25Q32JVTCIQ TR
Winbond Electronics
W25Q64JVTCIQ
Winbond Electronics
W25Q64JVTCIQ TR
Winbond Electronics
W25Q128FVCIF
Winbond Electronics
W25Q128FVCIG
Winbond Electronics
W25Q128FVCIG TR
Winbond Electronics
W25Q128FVCIP
Winbond Electronics
W25Q128FVCJF
Winbond Electronics
XC4013XL-2HT144C
Xilinx Inc.
LFXP6E-4TN144C
Lattice Semiconductor Corporation
A1020B-PQG100C
Microsemi Corporation
XC3S250E-5VQG100C
Xilinx Inc.
A3P600-2FGG256I
Microsemi Corporation
A3P1000-PQG208I
Microsemi Corporation
A42MX16-1PQG208M
Microsemi Corporation
LFE3-35EA-6FTN256I
Lattice Semiconductor Corporation
LFEC6E-3F484C
Lattice Semiconductor Corporation
LCMXO2-2000HE-5MG132I
Lattice Semiconductor Corporation