Home / Products / Capacitors / Tantalum Capacitors / TH3D226K016C0800
Manufacturer Part Number | TH3D226K016C0800 |
---|---|
Future Part Number | FT-TH3D226K016C0800 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | TANTAMOUNT®, TH3 |
TH3D226K016C0800 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 22µF |
Tolerance | ±10% |
Voltage - Rated | 16V |
Type | Molded |
ESR (Equivalent Series Resistance) | 800 mOhm |
Operating Temperature | -55°C ~ 150°C |
Lifetime @ Temp. | - |
Mounting Type | Surface Mount |
Package / Case | 2917 (7343 Metric) |
Size / Dimension | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
Height - Seated (Max) | 0.122" (3.10mm) |
Lead Spacing | - |
Manufacturer Size Code | D |
Ratings | AEC-Q200 |
Features | Automotive |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TH3D226K016C0800 Weight | Contact Us |
Replacement Part Number | TH3D226K016C0800-FT |
THJA105K035AJN
AVX Corporation
THJA154K035RJN
AVX Corporation
THJA155K020RJN
AVX Corporation
THJA224K035RJN
AVX Corporation
THJA224M035RJN
AVX Corporation
THJA225K016RJN
AVX Corporation
THJA225M016RJN
AVX Corporation
THJA334K035RJN
AVX Corporation
THJA334M035RJN
AVX Corporation
THJA335K016AJN
AVX Corporation
XC6SLX100-N3FGG484C
Xilinx Inc.
A3P600-1FG256I
Microsemi Corporation
M1A3P400-2FG256I
Microsemi Corporation
EP2C50F672C8
Intel
EP1AGX35CF484C6N
Intel
EP4SGX290FH29I3N
Intel
5SGXEA7K3F35I3LN
Intel
XC7K70T-L2FBG484E
Xilinx Inc.
LCMXO2280E-4BN256C
Lattice Semiconductor Corporation
ICE40LP1K-CM81TR1K
Lattice Semiconductor Corporation