Home / Products / Capacitors / Tantalum Capacitors / TH3D106M025D0900
Manufacturer Part Number | TH3D106M025D0900 |
---|---|
Future Part Number | FT-TH3D106M025D0900 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | TANTAMOUNT®, TH3 |
TH3D106M025D0900 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 10µF |
Tolerance | ±20% |
Voltage - Rated | 25V |
Type | Molded |
ESR (Equivalent Series Resistance) | 900 mOhm |
Operating Temperature | -55°C ~ 150°C |
Lifetime @ Temp. | - |
Mounting Type | Surface Mount |
Package / Case | 2917 (7343 Metric) |
Size / Dimension | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
Height - Seated (Max) | 0.122" (3.10mm) |
Lead Spacing | - |
Manufacturer Size Code | D |
Ratings | AEC-Q200 |
Features | Automotive |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TH3D106M025D0900 Weight | Contact Us |
Replacement Part Number | TH3D106M025D0900-FT |
F971V334MAAHT3
AVX Corporation
F971V474MAA
AVX Corporation
F971V684MAAHT3
AVX Corporation
THJA106K006RJN
AVX Corporation
F970J336MAAHT3
AVX Corporation
F970J475MAA
AVX Corporation
F971A106MAA
AVX Corporation
F971A225MAA
AVX Corporation
F971A226MAA
AVX Corporation
F971A335MAA
AVX Corporation
XC3S50A-4TQ144I
Xilinx Inc.
XC7A200T-1FBG676I
Xilinx Inc.
A3P1000-1FGG256
Microsemi Corporation
M7A3P1000-2PQG208I
Microsemi Corporation
EP1S20F484C6
Intel
5SGXEA5H2F35I3
Intel
XC2V6000-5FFG1152I
Xilinx Inc.
APA300-FGG144
Microsemi Corporation
LFE2M50SE-6F484C
Lattice Semiconductor Corporation
EP4SGX110HF35I3N
Intel