Home / Products / Capacitors / Tantalum Capacitors / TH3A475M010F2900
Manufacturer Part Number | TH3A475M010F2900 |
---|---|
Future Part Number | FT-TH3A475M010F2900 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | TANTAMOUNT®, TH3 |
TH3A475M010F2900 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 4.7µF |
Tolerance | ±20% |
Voltage - Rated | 10V |
Type | Molded |
ESR (Equivalent Series Resistance) | 2.9 Ohm |
Operating Temperature | -55°C ~ 150°C |
Lifetime @ Temp. | - |
Mounting Type | Surface Mount |
Package / Case | 1206 (3216 Metric) |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
Height - Seated (Max) | 0.071" (1.80mm) |
Lead Spacing | - |
Manufacturer Size Code | A |
Ratings | AEC-Q200 |
Features | Automotive |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TH3A475M010F2900 Weight | Contact Us |
Replacement Part Number | TH3A475M010F2900-FT |
T495X477K010ATE050
KEMET
T495X477K010ATE080
KEMET
T495X477M004ATE060
KEMET
T495X477M006ATE045
KEMET
T495X477M006ATE060
KEMET
T495X477M006ATE100
KEMET
T495X477M010ATE060
KEMET
T495X477M010ATE080
KEMET
T495X477M010ATE100
KEMET
T495X685M035ATE300
KEMET
EX256-FTQG100
Microsemi Corporation
XCVU080-2FFVC1517E
Xilinx Inc.
XC6VLX130T-2FFG484I
Xilinx Inc.
A42MX36-2PQG208I
Microsemi Corporation
A54SX08A-PQ208
Microsemi Corporation
10M40DAF484I7G
Intel
EP3C5U256C8N
Intel
EP2AGX95DF25I3N
Intel
AGL250V5-CS196I
Microsemi Corporation
LCMXO2-4000ZE-3BG256C
Lattice Semiconductor Corporation