Home / Products / Resistors / Chassis Mount Resistors / TE500B1K0J
Manufacturer Part Number | TE500B1K0J |
---|---|
Future Part Number | FT-TE500B1K0J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | TE, CGS |
TE500B1K0J Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 1 kOhms |
Tolerance | ±5% |
Power (Watts) | 500W |
Composition | Wirewound |
Temperature Coefficient | ±440ppm/°C |
Operating Temperature | -25°C ~ 225°C |
Features | Flame Proof, Safety |
Coating, Housing Type | Silicone Coated |
Mounting Feature | Brackets |
Size / Dimension | 1.969" Dia x 12.441" L (50.00mm x 316.00mm) |
Height - Seated (Max) | - |
Lead Style | Solder Lugs |
Package / Case | Radial, Tubular |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TE500B1K0J Weight | Contact Us |
Replacement Part Number | TE500B1K0J-FT |
HSC1003R0J
TE Connectivity Passive Product
HSC1004R7J
TE Connectivity Passive Product
HSC1001R5J
TE Connectivity Passive Product
HSC1001K2J
TE Connectivity Passive Product
HSC100470RJ
TE Connectivity Passive Product
HSC10047RJ
TE Connectivity Passive Product
HSC1005R6J
TE Connectivity Passive Product
HSC10022KJ
TE Connectivity Passive Product
HSC10047KJ
TE Connectivity Passive Product
HSC1001K0J
TE Connectivity Passive Product
AT6003ALV-4AC
Microchip Technology
XCKU060-3FFVA1517E
Xilinx Inc.
APA600-FGG256
Microsemi Corporation
APA1000-CQ208B
Microsemi Corporation
5SGXEA7N3F40C4N
Intel
5SGXEB9R1H43C2N
Intel
5SGXEBBR2H43I2LN
Intel
XC4VSX55-10FFG1148C
Xilinx Inc.
EP20K1000CB652C7N
Intel
5SGSMD4H2F35I2N
Intel