Home / Products / Integrated Circuits (ICs) / Memory / TC58BVG1S3HBAI4
Manufacturer Part Number | TC58BVG1S3HBAI4 |
---|---|
Future Part Number | FT-TC58BVG1S3HBAI4 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Benand™ |
TC58BVG1S3HBAI4 Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND (SLC) |
Memory Size | 2Gb (256M x 8) |
Clock Frequency | - |
Write Cycle Time - Word, Page | 25ns |
Access Time | - |
Memory Interface | - |
Voltage - Supply | 2.7V ~ 3.6V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 63-VFBGA |
Supplier Device Package | 63-TFBGA (9x11) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC58BVG1S3HBAI4 Weight | Contact Us |
Replacement Part Number | TC58BVG1S3HBAI4-FT |
W25Q64JVTCIQ
Winbond Electronics
W25Q64JVTCIQ TR
Winbond Electronics
W25Q128FVCIF
Winbond Electronics
W25Q128FVCIG
Winbond Electronics
W25Q128FVCIG TR
Winbond Electronics
W25Q128FVCIP
Winbond Electronics
W25Q128FVCJF
Winbond Electronics
W25Q128FVCJF TR
Winbond Electronics
W25Q128FVCJQ
Winbond Electronics
W25Q128FVCJQ TR
Winbond Electronics
XC3S50A-4VQ100C
Xilinx Inc.
XC6SLX150T-2FG484I
Xilinx Inc.
M1A3P600-1FGG484
Microsemi Corporation
A3P125-2PQ208I
Microsemi Corporation
5AGZME5K3F40I4N
Intel
10CX150YF672E5G
Intel
AX500-FGG676M
Microsemi Corporation
A3P1000-FGG144I
Microsemi Corporation
A54SX32A-2FGG144
Microsemi Corporation
LCMXO3LF-9400C-5BG256I
Lattice Semiconductor Corporation