Home / Products / Integrated Circuits (ICs) / Memory / TC58BVG0S3HTA00
Manufacturer Part Number | TC58BVG0S3HTA00 |
---|---|
Future Part Number | FT-TC58BVG0S3HTA00 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Benand™ |
TC58BVG0S3HTA00 Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Non-Volatile |
Memory Format | FLASH |
Technology | FLASH - NAND (SLC) |
Memory Size | 1Gb (128M x 8) |
Clock Frequency | - |
Write Cycle Time - Word, Page | 25ns |
Access Time | 25ns |
Memory Interface | Parallel |
Voltage - Supply | 2.7V ~ 3.6V |
Operating Temperature | 0°C ~ 70°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
Supplier Device Package | 48-TSOP I |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC58BVG0S3HTA00 Weight | Contact Us |
Replacement Part Number | TC58BVG0S3HTA00-FT |
W971GG6SB-18 TR
Winbond Electronics
W971GG6SB-25 TR
Winbond Electronics
W971GG6SB25I TR
Winbond Electronics
W9725G6IB-25
Winbond Electronics
W9725G6JB25I
Winbond Electronics
W9725G6KB-18
Winbond Electronics
W9725G6KB-18 TR
Winbond Electronics
W9725G6KB25I
Winbond Electronics
W9725G6KB25I TR
Winbond Electronics
W9751G6IB-25
Winbond Electronics
XC3S1000-4FGG320I
Xilinx Inc.
M1A3P600L-FG484I
Microsemi Corporation
M2GL050TS-1FG484I
Microsemi Corporation
5SGXMA5N3F40C4N
Intel
EP2AGZ350FH29I4N
Intel
5SGSED6N1F45I2N
Intel
XC5VFX130T-1FFG1738I
Xilinx Inc.
XC7VX485T-1FFG1157I
Xilinx Inc.
EPF10K70RC240-3N
Intel
5AGZME1H3F35C4N
Intel