Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / MC9S12XEP768CAL
Manufacturer Part Number | MC9S12XEP768CAL |
---|---|
Future Part Number | FT-MC9S12XEP768CAL |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | HCS12X |
MC9S12XEP768CAL Status (Lifecycle) | In Stock |
Part Status | Active |
Core Processor | HCS12X |
Core Size | 16-Bit |
Speed | 50MHz |
Connectivity | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI |
Peripherals | LVD, POR, PWM, WDT |
Number of I/O | 91 |
Program Memory Size | 768KB (768K x 8) |
Program Memory Type | FLASH |
EEPROM Size | 4K x 8 |
RAM Size | 48K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.72V ~ 5.5V |
Data Converters | A/D 16x12b |
Oscillator Type | External |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 112-LQFP |
Base Part Number | 112-LQFP (20x20) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
MC9S12XEP768CAL Weight | Contact Us |
Replacement Part Number | MC9S12XEP768CAL-FT |
P87C51RC2BBD,157
NXP USA Inc.
P87C51RD2BBD,157
NXP USA Inc.
P87C51RD2FBD/01,15
NXP USA Inc.
P87C51X2BBD,157
NXP USA Inc.
P87C52X2BBD,157
NXP USA Inc.
P87C52X2FBD,157
NXP USA Inc.
P87C54X2BBD,157
NXP USA Inc.
P87C54X2FBD,157
NXP USA Inc.
P87C58X2BBD,157
NXP USA Inc.
P87C654X2BBD,157
NXP USA Inc.
XC3S50A-4VQG100I
Xilinx Inc.
XC2V500-4FGG456I
Xilinx Inc.
A42MX24-3PQG208
Microsemi Corporation
APA600-FG676I
Microsemi Corporation
XC4VFX60-10FF672C
Xilinx Inc.
XC2VP7-7FFG672C
Xilinx Inc.
XA7S25-1CSGA225Q
Xilinx Inc.
APA075-FGG144
Microsemi Corporation
LFE2-6SE-7FN256C
Lattice Semiconductor Corporation
5CGTFD7D5F31I7N
Intel