Home / Products / Integrated Circuits (ICs) / PMIC - Power Management - Specialized / MC33FS6510LAE
Manufacturer Part Number | MC33FS6510LAE |
---|---|
Future Part Number | FT-MC33FS6510LAE |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
MC33FS6510LAE Status (Lifecycle) | In Stock |
Part Status | Active |
Applications | System Basis Chip |
Current - Supply | - |
Voltage - Supply | -1.0V ~ 40V |
Operating Temperature | -40°C ~ 125°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 48-LQFP Exposed Pad |
Supplier Device Package | 48-LQFP (7x7) |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
MC33FS6510LAE Weight | Contact Us |
Replacement Part Number | MC33FS6510LAE-FT |
MC33PF3000A5ES
NXP USA Inc.
MC33PF3000A6ES
NXP USA Inc.
MC33PF3000A6ESR2
NXP USA Inc.
MC33PF3000A7ESR2
NXP USA Inc.
MC33PF3001A6ES
NXP USA Inc.
MC33PF3001A6ESR2
NXP USA Inc.
MC33PF3001A7ES
NXP USA Inc.
MC33PF3001A7ESR2
NXP USA Inc.
MC34PF3000A0EPR2
NXP USA Inc.
MC34PF3000A1EPR2
NXP USA Inc.
XC6SLX9-3TQG144C
Xilinx Inc.
XC4013XL-09HT144C
Xilinx Inc.
XC7K160T-L2FBG676E
Xilinx Inc.
P1AFS1500-2FG256
Microsemi Corporation
EPF6010ATC100-1
Intel
10AX027H3F34I2SG
Intel
5SGXMB5R3F43C2N
Intel
5AGZME5H3F35C4N
Intel
XC6SLX16-3CSG324C
Xilinx Inc.
M1AGL1000V2-FG144
Microsemi Corporation