Home / Products / Integrated Circuits (ICs) / Embedded - Microcontrollers / MB89925PMC1-G-161-BNDE1
Manufacturer Part Number | MB89925PMC1-G-161-BNDE1 |
---|---|
Future Part Number | FT-MB89925PMC1-G-161-BNDE1 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | F²MC-8L MB89920 |
MB89925PMC1-G-161-BNDE1 Status (Lifecycle) | In Stock |
Part Status | Obsolete |
Core Processor | F²MC-8L |
Core Size | 8-Bit |
Speed | 8MHz |
Connectivity | Serial I/O, UART/USART |
Peripherals | LCD, LVD, POR, PWM, WDT |
Number of I/O | 69 |
Program Memory Size | 16KB (16K x 8) |
Program Memory Type | Mask ROM |
EEPROM Size | - |
RAM Size | 512 x 8 |
Voltage - Supply (Vcc/Vdd) | 2.2V ~ 6V |
Data Converters | A/D 8x10b |
Oscillator Type | External |
Operating Temperature | -40°C ~ 85°C (TA) |
Package / Case | Surface Mount |
Supplier Device Package | 80-LQFP |
Base Part Number | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
MB89925PMC1-G-161-BNDE1 Weight | Contact Us |
Replacement Part Number | MB89925PMC1-G-161-BNDE1-FT |
STM8L162M8T6TR
STMicroelectronics
STM8S207M8T6B
STMicroelectronics
STM8S207M8T6BTR
STMicroelectronics
STM8S207MBT6B
STMicroelectronics
R5F100MHAFA#V0
Renesas Electronics America
MC9S08AC128MLKE
NXP USA Inc.
MC9S08AC96CLKE
NXP USA Inc.
MC9S08AC96MLKE
NXP USA Inc.
MC9S08GW32CLK
NXP USA Inc.
MC9S08GW64CLK
NXP USA Inc.
A40MX04-VQ80I
Microsemi Corporation
EX256-PTQG100
Microsemi Corporation
XC2V1500-5FG676I
Xilinx Inc.
M1A3P400-PQ208
Microsemi Corporation
EP2A25F672C7
Intel
EPF10K200SBC672-2X
Intel
EP2C70F672C7N
Intel
XC7VX485T-2FFG1157C
Xilinx Inc.
LFXP6C-4F256I
Lattice Semiconductor Corporation
LCMXO2-640ZE-1MG132C
Lattice Semiconductor Corporation