Home / Products / Integrated Circuits (ICs) / Memory / M93C66-WMN6P
Manufacturer Part Number | M93C66-WMN6P |
---|---|
Future Part Number | FT-M93C66-WMN6P |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | - |
M93C66-WMN6P Status (Lifecycle) | In Stock |
Part Status | Active |
Memory Type | Non-Volatile |
Memory Format | EEPROM |
Technology | EEPROM |
Memory Size | 4Kb (512 x 8, 256 x 16) |
Clock Frequency | 2MHz |
Write Cycle Time - Word, Page | 5ms |
Access Time | - |
Memory Interface | SPI |
Voltage - Supply | 2.5V ~ 5.5V |
Operating Temperature | -40°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package | 8-SO |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
M93C66-WMN6P Weight | Contact Us |
Replacement Part Number | M93C66-WMN6P-FT |
W97AH6KBVX2E TR
Winbond Electronics
W97AH6KBVX2I TR
Winbond Electronics
W97BH2KBVX2E
Winbond Electronics
W97BH2KBVX2I
Winbond Electronics
W97BH6KBVX2E
Winbond Electronics
W97BH6KBVX2I
Winbond Electronics
THGBMHG6C1LBAIL
Toshiba Memory America, Inc.
THGBMNG5D1LBAIT
Toshiba Memory America, Inc.
THGBMHG8C2LBAIL
Toshiba Memory America, Inc.
THGBMHG6C1LBAWL
Toshiba Memory America, Inc.
XC3S50A-4VQ100C
Xilinx Inc.
XC6SLX150T-2FG484I
Xilinx Inc.
M1A3P600-1FGG484
Microsemi Corporation
A3P125-2PQ208I
Microsemi Corporation
5AGZME5K3F40I4N
Intel
10CX150YF672E5G
Intel
AX500-FGG676M
Microsemi Corporation
A3P1000-FGG144I
Microsemi Corporation
A54SX32A-2FGG144
Microsemi Corporation
LCMXO3LF-9400C-5BG256I
Lattice Semiconductor Corporation