Home / Products / Resistors / Chassis Mount Resistors / HSC200R10J
Manufacturer Part Number | HSC200R10J |
---|---|
Future Part Number | FT-HSC200R10J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | HS, CGS |
HSC200R10J Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 100 mOhms |
Tolerance | ±5% |
Power (Watts) | 200W |
Composition | Wirewound |
Temperature Coefficient | ±50ppm/°C |
Operating Temperature | -55°C ~ 200°C |
Features | - |
Coating, Housing Type | Aluminum |
Mounting Feature | Flanges |
Size / Dimension | 3.543" L x 2.874" W (90.00mm x 73.00mm) |
Height - Seated (Max) | 1.654" (42.00mm) |
Lead Style | Terminal Screw Type |
Package / Case | Axial, Box |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
HSC200R10J Weight | Contact Us |
Replacement Part Number | HSC200R10J-FT |
BDS2A10015RK
TE Connectivity Passive Product
BDS2A100220RK
TE Connectivity Passive Product
BDS2A1002K2K
TE Connectivity Passive Product
BDS2A100680RK
TE Connectivity Passive Product
BDS2A10068RK
TE Connectivity Passive Product
BDS4B100R47K
TE Connectivity Passive Product
BDS2A100100RK
TE Connectivity Passive Product
BDS2A1002R2K
TE Connectivity Passive Product
TE2500B1R0J
TE Connectivity Passive Product
TE2500B100RJ
TE Connectivity Passive Product
XC3S400-4FG320C
Xilinx Inc.
XC3S250E-4VQG100I
Xilinx Inc.
A42MX36-CQ256M
Microsemi Corporation
AGLN060V5-ZVQG100
Microsemi Corporation
10M16DCF256C8G
Intel
EP1K10FC256-2
Intel
5SGXMA4K3F35C2LN
Intel
LFEC10E-4FN484I
Lattice Semiconductor Corporation
EP2AGX65DF29C4N
Intel
EP2SGX30CF780C3N
Intel