Home / Products / Resistors / Through Hole Resistors / H895R3DZA
Manufacturer Part Number | H895R3DZA |
---|---|
Future Part Number | FT-H895R3DZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H895R3DZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 95.3 Ohms |
Tolerance | ±0.5% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H895R3DZA Weight | Contact Us |
Replacement Part Number | H895R3DZA-FT |
H8887RBZA
TE Connectivity Passive Product
H888K7BCA
TE Connectivity Passive Product
H888K7BDA
TE Connectivity Passive Product
H888K7BYA
TE Connectivity Passive Product
H888K7BZA
TE Connectivity Passive Product
H889K5BAA
TE Connectivity Passive Product
H88K06BCA
TE Connectivity Passive Product
H88K06BDA
TE Connectivity Passive Product
H88K06BYA
TE Connectivity Passive Product
H88K06BZA
TE Connectivity Passive Product
M1A3P600L-FG256I
Microsemi Corporation
M1AFS250-FG256
Microsemi Corporation
MPF100T-FCG484E
Microsemi Corporation
10M16SCE144C7G
Intel
5SGXEA5H2F35I3
Intel
XC6SLX25T-2CSG324I
Xilinx Inc.
XC7S25-1CSGA324I
Xilinx Inc.
LFEC6E-5QN208C
Lattice Semiconductor Corporation
LCMXO2-2000HC-6BG256I
Lattice Semiconductor Corporation
LCMXO2-2000HC-5MG132I
Lattice Semiconductor Corporation