Home / Products / Resistors / Through Hole Resistors / H890R9DZA
Manufacturer Part Number | H890R9DZA |
---|---|
Future Part Number | FT-H890R9DZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H890R9DZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 90.9 Ohms |
Tolerance | ±0.5% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H890R9DZA Weight | Contact Us |
Replacement Part Number | H890R9DZA-FT |
H882RFDA
TE Connectivity Passive Product
H882RFYA
TE Connectivity Passive Product
H882RFZA
TE Connectivity Passive Product
H8845KBCA
TE Connectivity Passive Product
H8845KBDA
TE Connectivity Passive Product
H8845KBYA
TE Connectivity Passive Product
H8845KBZA
TE Connectivity Passive Product
H8845RBCA
TE Connectivity Passive Product
H8845RBDA
TE Connectivity Passive Product
H8845RBYA
TE Connectivity Passive Product
XCV50-6TQ144C
Xilinx Inc.
XCV100E-7FG256C
Xilinx Inc.
XC7A75T-L2FGG676E
Xilinx Inc.
M2GL005-1FG484
Microsemi Corporation
LFE5UM-45F-6BG554C
Lattice Semiconductor Corporation
A3PN060-Z2VQ100
Microsemi Corporation
5SGXEA9N1F45I2N
Intel
XC5VLX330T-2FFG1738C
Xilinx Inc.
XC6SLX9-2CPG196C
Xilinx Inc.
5SGXMA3H3F35C4N
Intel