Home / Products / Resistors / Through Hole Resistors / H88K66BDA
Manufacturer Part Number | H88K66BDA |
---|---|
Future Part Number | FT-H88K66BDA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H88K66BDA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 8.66 kOhms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±25ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H88K66BDA Weight | Contact Us |
Replacement Part Number | H88K66BDA-FT |
H8820RBYA
TE Connectivity Passive Product
H8820RFCA
TE Connectivity Passive Product
H8820RFDA
TE Connectivity Passive Product
H8820RFYA
TE Connectivity Passive Product
H8820RFZA
TE Connectivity Passive Product
H8825KBCA
TE Connectivity Passive Product
H8825KBDA
TE Connectivity Passive Product
H8825KBYA
TE Connectivity Passive Product
H8825KBZA
TE Connectivity Passive Product
H8825RBCA
TE Connectivity Passive Product
EX128-PTQ100
Microsemi Corporation
XC2VP20-5FGG676C
Xilinx Inc.
M2GL090-FCSG325I
Microsemi Corporation
XC6SLX75T-N3FG484C
Xilinx Inc.
AT40K40-2DQC
Microchip Technology
EP4CGX30CF23C7N
Intel
EP4SE530H40I4N
Intel
XC7K325T-2FFG676I
Xilinx Inc.
APA075-FGG144A
Microsemi Corporation
EP1C20F324C8N
Intel