Home / Products / Resistors / Through Hole Resistors / H86K81BZA
Manufacturer Part Number | H86K81BZA |
---|---|
Future Part Number | FT-H86K81BZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H86K81BZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 6.81 kOhms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H86K81BZA Weight | Contact Us |
Replacement Part Number | H86K81BZA-FT |
H866R5BDA
TE Connectivity Passive Product
H866R5BYA
TE Connectivity Passive Product
H866R5BZA
TE Connectivity Passive Product
H8680KFCA
TE Connectivity Passive Product
H8680KFDA
TE Connectivity Passive Product
H8680KFYA
TE Connectivity Passive Product
H8680KFZA
TE Connectivity Passive Product
H8680RBYA
TE Connectivity Passive Product
H8680RFCA
TE Connectivity Passive Product
H8680RFDA
TE Connectivity Passive Product
XC2S100-5TQG144C
Xilinx Inc.
XC6SLX75-L1CSG484C
Xilinx Inc.
XC3S1000-4FTG256I
Xilinx Inc.
XC6SLX75-L1FG676I
Xilinx Inc.
XC2S150-6FGG456C
Xilinx Inc.
XC6SLX75-3FGG484C
Xilinx Inc.
M2GL010S-1FG484I
Microsemi Corporation
M2GL010T-1FGG484I
Microsemi Corporation
XC2V3000-5BG728I
Xilinx Inc.
EP2AGX95EF35C6N
Intel