Home / Products / Resistors / Through Hole Resistors / H83K57BZA
Manufacturer Part Number | H83K57BZA |
---|---|
Future Part Number | FT-H83K57BZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H83K57BZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 3.57 kOhms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H83K57BZA Weight | Contact Us |
Replacement Part Number | H83K57BZA-FT |
H8383RDZA
TE Connectivity Passive Product
H838K3BCA
TE Connectivity Passive Product
H838K3BDA
TE Connectivity Passive Product
H838K3BYA
TE Connectivity Passive Product
H838K3BZA
TE Connectivity Passive Product
H838K3DCA
TE Connectivity Passive Product
H838K3DYA
TE Connectivity Passive Product
H838K3DZA
TE Connectivity Passive Product
H838R3BCA
TE Connectivity Passive Product
H838R3BDA
TE Connectivity Passive Product
LCMXO1200C-3TN100I
Lattice Semiconductor Corporation
XA6SLX9-3FTG256I
Xilinx Inc.
XC2V40-5FGG256I
Xilinx Inc.
XC3S500E-4PQG208C
Xilinx Inc.
5SGSED8K1F40I2N
Intel
EP4S100G5F45I3N
Intel
XC6VLX240T-2FFG1759I
Xilinx Inc.
XC7K325T-1FF900C
Xilinx Inc.
EP2AGX190EF29I5G
Intel
EP3SE80F780I4
Intel