Home / Products / Resistors / Through Hole Resistors / H816R2BDA
Manufacturer Part Number | H816R2BDA |
---|---|
Future Part Number | FT-H816R2BDA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H816R2BDA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 16.2 Ohms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±25ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H816R2BDA Weight | Contact Us |
Replacement Part Number | H816R2BDA-FT |
H815K4DCA
TE Connectivity Passive Product
H815K4DYA
TE Connectivity Passive Product
H815K4DZA
TE Connectivity Passive Product
H815K4FDA
TE Connectivity Passive Product
H815K8BCA
TE Connectivity Passive Product
H815K8BDA
TE Connectivity Passive Product
H815K8BYA
TE Connectivity Passive Product
H815K8BZA
TE Connectivity Passive Product
H815KBCA
TE Connectivity Passive Product
H815KBDA
TE Connectivity Passive Product
XC6SLX75-2CSG484I
Xilinx Inc.
XA3S1500-4FGG456I
Xilinx Inc.
XC3S1400A-4FG484I
Xilinx Inc.
M2GL010TS-VFG256
Microsemi Corporation
LCMXO640C-5FTN256C
Lattice Semiconductor Corporation
LCMXO3L-4300C-5BG324I
Lattice Semiconductor Corporation
EP4SE360H29C4
Intel
XC2VP20-6FFG896I
Xilinx Inc.
M1AGL1000V2-CS281I
Microsemi Corporation
EP1C20F400C6
Intel