Home / Products / Resistors / Through Hole Resistors / H816K9BDA
Manufacturer Part Number | H816K9BDA |
---|---|
Future Part Number | FT-H816K9BDA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H816K9BDA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 16.9 kOhms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±25ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H816K9BDA Weight | Contact Us |
Replacement Part Number | H816K9BDA-FT |
H8158KBZA
TE Connectivity Passive Product
H8158RAYA
TE Connectivity Passive Product
H8158RBCA
TE Connectivity Passive Product
H8158RBDA
TE Connectivity Passive Product
H8158RBYA
TE Connectivity Passive Product
H8158RBZA
TE Connectivity Passive Product
H8158RFZA
TE Connectivity Passive Product
H815K4BCA
TE Connectivity Passive Product
H815K4BDA
TE Connectivity Passive Product
H815K4BYA
TE Connectivity Passive Product
XC6SLX150-N3CSG484I
Xilinx Inc.
XC3S200-4VQ100I
Xilinx Inc.
AFS1500-FG484I
Microsemi Corporation
M1A3PE3000L-FGG484M
Microsemi Corporation
A3P400-PQG208
Microsemi Corporation
XC7A15T-1CSG324C
Xilinx Inc.
10AX115H2F34I2SG
Intel
EP2SGX60DF780C5
Intel
10AX048E2F29I1HG
Intel
EP1C4F400C7N
Intel