Home / Products / Resistors / Through Hole Resistors / H813R3BYA
Manufacturer Part Number | H813R3BYA |
---|---|
Future Part Number | FT-H813R3BYA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H813R3BYA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 13.3 Ohms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±15ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H813R3BYA Weight | Contact Us |
Replacement Part Number | H813R3BYA-FT |
H8127RDYA
TE Connectivity Passive Product
H8127RDZA
TE Connectivity Passive Product
H812K1BYA
TE Connectivity Passive Product
H812K1DCA
TE Connectivity Passive Product
H812K1DYA
TE Connectivity Passive Product
H812K1DZA
TE Connectivity Passive Product
H812K4BCA
TE Connectivity Passive Product
H812K4BDA
TE Connectivity Passive Product
H812K4BYA
TE Connectivity Passive Product
H812K4BZA
TE Connectivity Passive Product
XC6SLX75-2CSG484I
Xilinx Inc.
XA3S1500-4FGG456I
Xilinx Inc.
XC3S1400A-4FG484I
Xilinx Inc.
M2GL010TS-VFG256
Microsemi Corporation
LCMXO640C-5FTN256C
Lattice Semiconductor Corporation
LCMXO3L-4300C-5BG324I
Lattice Semiconductor Corporation
EP4SE360H29C4
Intel
XC2VP20-6FFG896I
Xilinx Inc.
M1AGL1000V2-CS281I
Microsemi Corporation
EP1C20F400C6
Intel