Home / Products / Resistors / Through Hole Resistors / H812R4BDA
Manufacturer Part Number | H812R4BDA |
---|---|
Future Part Number | FT-H812R4BDA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H812R4BDA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 12.4 Ohms |
Tolerance | ±0.1% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±25ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H812R4BDA Weight | Contact Us |
Replacement Part Number | H812R4BDA-FT |
H811K3BYA
TE Connectivity Passive Product
H811K5BYA
TE Connectivity Passive Product
H811K5DCA
TE Connectivity Passive Product
H811K5DYA
TE Connectivity Passive Product
H811K5DZA
TE Connectivity Passive Product
H811K8BYA
TE Connectivity Passive Product
H811K8BZA
TE Connectivity Passive Product
H811K8FDA
TE Connectivity Passive Product
H811KBDA
TE Connectivity Passive Product
H811KBYA
TE Connectivity Passive Product
XC6SLX75-2CSG484I
Xilinx Inc.
XA3S1500-4FGG456I
Xilinx Inc.
XC3S1400A-4FG484I
Xilinx Inc.
M2GL010TS-VFG256
Microsemi Corporation
LCMXO640C-5FTN256C
Lattice Semiconductor Corporation
LCMXO3L-4300C-5BG324I
Lattice Semiconductor Corporation
EP4SE360H29C4
Intel
XC2VP20-6FFG896I
Xilinx Inc.
M1AGL1000V2-CS281I
Microsemi Corporation
EP1C20F400C6
Intel