Home / Products / Resistors / Through Hole Resistors / H812R1DCA
Manufacturer Part Number | H812R1DCA |
---|---|
Future Part Number | FT-H812R1DCA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H812R1DCA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 12.1 Ohms |
Tolerance | ±0.5% |
Power (Watts) | 0.25W, 1/4W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±50ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H812R1DCA Weight | Contact Us |
Replacement Part Number | H812R1DCA-FT |
H8118RBDA
TE Connectivity Passive Product
H8118RBYA
TE Connectivity Passive Product
H8118RBZA
TE Connectivity Passive Product
H811K3BYA
TE Connectivity Passive Product
H811K5BYA
TE Connectivity Passive Product
H811K5DCA
TE Connectivity Passive Product
H811K5DYA
TE Connectivity Passive Product
H811K5DZA
TE Connectivity Passive Product
H811K8BYA
TE Connectivity Passive Product
H811K8BZA
TE Connectivity Passive Product
XC3S200A-4FT256C
Xilinx Inc.
XC6SLX25T-2FGG484I
Xilinx Inc.
M7A3P1000-2FGG484
Microsemi Corporation
AFS1500-FG256K
Microsemi Corporation
EP20K30EFC144-2X
Intel
5SGXMA3K3F35I4N
Intel
XC5VLX110-3FFG676C
Xilinx Inc.
LCMXO2-2000HE-4MG132I
Lattice Semiconductor Corporation
10AX066N4F40I3SG
Intel
EP1K50QC208-2N
Intel