Home / Products / Resistors / Through Hole Resistors / H4P562KDZA
Manufacturer Part Number | H4P562KDZA |
---|---|
Future Part Number | FT-H4P562KDZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H4P562KDZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 562 kOhms |
Tolerance | ±0.5% |
Power (Watts) | 1W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.146" Dia x 0.394" L (3.70mm x 10.00mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H4P562KDZA Weight | Contact Us |
Replacement Part Number | H4P562KDZA-FT |
H44K64DYA
TE Connectivity Passive Product
H44K7DZA
TE Connectivity Passive Product
H44K87DYA
TE Connectivity Passive Product
H451R1DYA
TE Connectivity Passive Product
H4536KDYA
TE Connectivity Passive Product
H453R6DYA
TE Connectivity Passive Product
H4562KDYA
TE Connectivity Passive Product
H456R2DYA
TE Connectivity Passive Product
H4590KDYA
TE Connectivity Passive Product
H459RDYA
TE Connectivity Passive Product
XC6SLX150-N3CSG484I
Xilinx Inc.
XC3S200-4VQ100I
Xilinx Inc.
AFS1500-FG484I
Microsemi Corporation
M1A3PE3000L-FGG484M
Microsemi Corporation
A3P400-PQG208
Microsemi Corporation
XC7A15T-1CSG324C
Xilinx Inc.
10AX115H2F34I2SG
Intel
EP2SGX60DF780C5
Intel
10AX048E2F29I1HG
Intel
EP1C4F400C7N
Intel