Home / Products / Resistors / Through Hole Resistors / H460R4BZA
Manufacturer Part Number | H460R4BZA |
---|---|
Future Part Number | FT-H460R4BZA |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | Holco, Holsworthy |
H460R4BZA Status (Lifecycle) | In Stock |
Part Status | Active |
Resistance | 60.4 Ohms |
Tolerance | ±0.1% |
Power (Watts) | 0.5W, 1/2W |
Composition | Metal Film |
Features | Pulse Withstanding |
Temperature Coefficient | ±100ppm/°C |
Operating Temperature | -55°C ~ 155°C |
Package / Case | Axial |
Supplier Device Package | Axial |
Size / Dimension | 0.146" Dia x 0.394" L (3.70mm x 10.00mm) |
Height - Seated (Max) | - |
Number of Terminations | 2 |
Failure Rate | - |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
H460R4BZA Weight | Contact Us |
Replacement Part Number | H460R4BZA-FT |
H4562KBYA
TE Connectivity Passive Product
H4562KBZA
TE Connectivity Passive Product
H4562KFYA
TE Connectivity Passive Product
H4562RBCA
TE Connectivity Passive Product
H4562RBDA
TE Connectivity Passive Product
H4562RBYA
TE Connectivity Passive Product
H4562RBZA
TE Connectivity Passive Product
H4562RDYA
TE Connectivity Passive Product
H456K2BCA
TE Connectivity Passive Product
H456K2BDA
TE Connectivity Passive Product
M2GL010T-FGG484
Microsemi Corporation
A54SX32A-PQ208I
Microsemi Corporation
LFE2M70E-5FN1152C
Lattice Semiconductor Corporation
5SGXEA7K1F40C1N
Intel
5SGSMD5H2F35I3LN
Intel
XC4010E-2HQ208C
Xilinx Inc.
AX500-1FG676I
Microsemi Corporation
5CEFA2U19C6N
Intel
5CGXFC7C6U19I7
Intel
EPF10K50SQC208-2
Intel