Home / Products / Capacitors / Ceramic Capacitors / FK28C0G2E681JN006
Manufacturer Part Number | FK28C0G2E681JN006 |
---|---|
Future Part Number | FT-FK28C0G2E681JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK28C0G2E681JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 680pF |
Tolerance | ±5% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.157" L x 0.098" W (4.00mm x 2.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK28C0G2E681JN006 Weight | Contact Us |
Replacement Part Number | FK28C0G2E681JN006-FT |
FK28C0G2A181J
TDK Corporation
FK28C0G1H562J
TDK Corporation
FK28X5R1A334K
TDK Corporation
FK28X7R1E334K
TDK Corporation
FK28X7R1E684K
TDK Corporation
FK28C0G1H472J
TDK Corporation
FK28C0G1H103J
TDK Corporation
FK28C0G2E101J
TDK Corporation
FK28C0G2E121J
TDK Corporation
FK28C0G2E151J
TDK Corporation
LCMXO2-1200HC-4TG144I
Lattice Semiconductor Corporation
XC3SD3400A-4FGG676I
Xilinx Inc.
A3P125-PQ208
Microsemi Corporation
M1A3P250-2VQ100
Microsemi Corporation
5SGXEA7K3F40I4N
Intel
EP3SE80F1152I4
Intel
A40MX02-3PLG44
Microsemi Corporation
XC6SLX9-3CSG324I
Xilinx Inc.
10AX115N4F40E3SG
Intel
5CGXFC9E7F35C8N
Intel