Home / Products / Capacitors / Ceramic Capacitors / FK26X7R1H155K
Manufacturer Part Number | FK26X7R1H155K |
---|---|
Future Part Number | FT-FK26X7R1H155K |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK26X7R1H155K Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1.5µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK26X7R1H155K Weight | Contact Us |
Replacement Part Number | FK26X7R1H155K-FT |
FK18C0G1H6R8D
TDK Corporation
FK16C0G1H223J
TDK Corporation
FK11C0G1H223J
TDK Corporation
FK18C0G2A471J
TDK Corporation
FK18C0G1H150J
TDK Corporation
FK26X5R1E155K
TDK Corporation
FK26X5R0J476M
TDK Corporation
FK26X7R2A684K
TDK Corporation
FK18X7S2A473K
TDK Corporation
FK11X5R0J107M
TDK Corporation
M1A3PE3000L-FG484I
Microsemi Corporation
A3PN010-QNG48
Microsemi Corporation
A3P400-2FGG256
Microsemi Corporation
XC4020XL-3HT176I
Xilinx Inc.
EP4CE10F17C6
Intel
5SGXMB6R2F40C3N
Intel
10AX027H4F35I3LG
Intel
XC7A35T-1CSG324C
Xilinx Inc.
LCMXO256E-5M100C
Lattice Semiconductor Corporation
EP1S40F780C8
Intel