Home / Products / Capacitors / Ceramic Capacitors / FK26C0G2E822J
Manufacturer Part Number | FK26C0G2E822J |
---|---|
Future Part Number | FT-FK26C0G2E822J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK26C0G2E822J Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 8200pF |
Tolerance | ±5% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
Height - Seated (Max) | 0.236" (6.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK26C0G2E822J Weight | Contact Us |
Replacement Part Number | FK26C0G2E822J-FT |
FK11X7R1C106K
TDK Corporation
FK11X7R1C106M
TDK Corporation
FK11X7R1E106K
TDK Corporation
FK11X7R2A474K
TDK Corporation
FK11X7R2A684K
TDK Corporation
FK11X7S2A335K
TDK Corporation
FK11Y5V0J107Z
TDK Corporation
FK11Y5V1A476Z
TDK Corporation
FK11Y5V1C226Z
TDK Corporation
FK11Y5V1C476Z
TDK Corporation
AGLE3000V2-FG484
Microsemi Corporation
AGL600V2-FG484
Microsemi Corporation
M1A3P600L-1FG484
Microsemi Corporation
A42MX24-3PQG208
Microsemi Corporation
LFE3-35EA-6FTN256I
Lattice Semiconductor Corporation
EP2C35F484C6N
Intel
10AX048H3F34I2SG
Intel
EP3SL150F1152C2
Intel
XC2VP40-6FFG1152I
Xilinx Inc.
A42MX24-PQG160A
Microsemi Corporation