Home / Products / Capacitors / Ceramic Capacitors / FK24C0G2E182J
Manufacturer Part Number | FK24C0G2E182J |
---|---|
Future Part Number | FT-FK24C0G2E182J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK24C0G2E182J Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1800pF |
Tolerance | ±5% |
Voltage - Rated | 250V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.217" L x 0.177" W (5.50mm x 4.50mm) |
Height - Seated (Max) | 0.217" (5.50mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK24C0G2E182J Weight | Contact Us |
Replacement Part Number | FK24C0G2E182J-FT |
FK22C0G2J153JN006
TDK Corporation
FK22C0G2J223JN006
TDK Corporation
FK22C0G2J822JN006
TDK Corporation
FK22X5R0J107MN006
TDK Corporation
FK22X5R0J686MN006
TDK Corporation
FK22X5R1A336MN006
TDK Corporation
FK22X5R1A476MN000
TDK Corporation
FK22X5R1A476MN006
TDK Corporation
FK22X5R1C336MN006
TDK Corporation
FK22X5R1E156MN006
TDK Corporation
XC3030-100PQ100C
Xilinx Inc.
XC6SLX150-2FGG676I
Xilinx Inc.
AGL030V2-VQ100
Microsemi Corporation
5SGXMA7K3F35C2N
Intel
XC7VX485T-1FFG1158I
Xilinx Inc.
XC2V2000-4FFG896C
Xilinx Inc.
XC7K410T-3FBG900E
Xilinx Inc.
LCMXO640C-5MN100C
Lattice Semiconductor Corporation
EP1S80B956C6
Intel
EP2S90F1020C5N
Intel