Home / Products / Capacitors / Ceramic Capacitors / FK22X7R1H155K
Manufacturer Part Number | FK22X7R1H155K |
---|---|
Future Part Number | FT-FK22X7R1H155K |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK22X7R1H155K Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 1.5µF |
Tolerance | ±10% |
Voltage - Rated | 50V |
Temperature Coefficient | X7R |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.295" L x 0.157" W (7.50mm x 4.00mm) |
Height - Seated (Max) | 0.315" (8.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK22X7R1H155K Weight | Contact Us |
Replacement Part Number | FK22X7R1H155K-FT |
CKG45KC0G2E683J290JH
TDK Corporation
CKG45KC0G2J333J290JJ
TDK Corporation
CKG45KC0G2E683J290JJ
TDK Corporation
CKG45KC0G2J333J290JH
TDK Corporation
CKG45KC0G2W473J290JH
TDK Corporation
CKG45KC0G2W473J290JJ
TDK Corporation
CKG32KC0G3A153J335AJ
TDK Corporation
B58031I5105M002
EPCOS (TDK)
B58031I5105M062
EPCOS (TDK)
B58031I7504M062
EPCOS (TDK)
AT6010A-2AU
Microchip Technology
XC2VP50-5FF1517C
Xilinx Inc.
XA3S250E-4VQG100Q
Xilinx Inc.
XC7A50T-L1FGG484I
Xilinx Inc.
APA600-FGG256A
Microsemi Corporation
EP4CE30F23C8N
Intel
XC7K355T-2FFG901C
Xilinx Inc.
LFE2M20E-6FN256I
Lattice Semiconductor Corporation
5CGXFC7D6F31C7N
Intel
10AX066K3F40I2LG
Intel