Home / Products / Capacitors / Ceramic Capacitors / FK22C0G2J223J
Manufacturer Part Number | FK22C0G2J223J |
---|---|
Future Part Number | FT-FK22C0G2J223J |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK22C0G2J223J Status (Lifecycle) | In Stock |
Part Status | Not For New Designs |
Capacitance | 0.022µF |
Tolerance | ±5% |
Voltage - Rated | 630V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.295" L x 0.157" W (7.50mm x 4.00mm) |
Height - Seated (Max) | 0.315" (8.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK22C0G2J223J Weight | Contact Us |
Replacement Part Number | FK22C0G2J223J-FT |
FA26X7R2J223KNU00
TDK Corporation
FA28C0G1H222JNU00
TDK Corporation
FA28C0G1H472JNU00
TDK Corporation
FA28C0G1H682JNU00
TDK Corporation
FA28C0G2A681JNU00
TDK Corporation
FA28C0G2E391JNU00
TDK Corporation
FA28X7R1H102KNU00
TDK Corporation
FA28X8R1E104KNU00
TDK Corporation
CNA6P1X7R1H106K250AE
TDK Corporation
CNA6P1X7R1H475K250AE
TDK Corporation
XC2S100E-6PQ208C
Xilinx Inc.
A3PE3000-2PQ208I
Microsemi Corporation
10CL006YU256C8G
Intel
10M04SCU169A7G
Intel
5SGXEA9N2F45I2N
Intel
XC6SLX25-3CSG324C
Xilinx Inc.
A54SX32A-1TQG100
Microsemi Corporation
LFE3-17EA-7LMG328I
Lattice Semiconductor Corporation
ICE40LP8K-CM121
Lattice Semiconductor Corporation
EP20K1000EBC652-1
Intel