Home / Products / Capacitors / Ceramic Capacitors / FK22C0G1H154JN006
Manufacturer Part Number | FK22C0G1H154JN006 |
---|---|
Future Part Number | FT-FK22C0G1H154JN006 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | FK |
FK22C0G1H154JN006 Status (Lifecycle) | In Stock |
Part Status | Active |
Capacitance | 0.15µF |
Tolerance | ±5% |
Voltage - Rated | 50V |
Temperature Coefficient | C0G, NP0 |
Operating Temperature | -55°C ~ 125°C |
Features | - |
Ratings | - |
Applications | General Purpose |
Failure Rate | - |
Mounting Type | Through Hole |
Package / Case | Radial |
Size / Dimension | 0.295" L x 0.157" W (7.50mm x 4.00mm) |
Height - Seated (Max) | 0.315" (8.00mm) |
Thickness (Max) | - |
Lead Spacing | 0.197" (5.00mm) |
Lead Style | Formed Leads - Kinked |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FK22C0G1H154JN006 Weight | Contact Us |
Replacement Part Number | FK22C0G1H154JN006-FT |
B58031I7504M002
EPCOS (TDK)
CAA572C0G2J204J640LH
TDK Corporation
CAA572C0G3A663J640LH
TDK Corporation
C5750C0G2A154J230KE
TDK Corporation
C5750C0G2E154J230KE
TDK Corporation
C5750C0G2J683J230KE
TDK Corporation
C4532C0G2J333J200KE
TDK Corporation
C3225C0G2E223J160AE
TDK Corporation
C3225C0G2A683J230AE
TDK Corporation
C3225C0G2W333J250AE
TDK Corporation
XC6SLX100T-2FGG676C
Xilinx Inc.
XC2V1000-4FG456I
Xilinx Inc.
A3PE1500-FGG484I
Microsemi Corporation
APA300-PQG208
Microsemi Corporation
EP2C50U484I8
Intel
5SGXEA4K2F40C1N
Intel
EP2AGX95DF25C5
Intel
10AX032E2F27I2SG
Intel
5SGXEA9N2F45I2L
Intel
ICE40LP384-CM49TR
Lattice Semiconductor Corporation